Highly Integrated Devices Provide High Thermal Performance and Efficiency While Reducing Component Count and PCB Area
ON Semiconductor has expanded its high voltage IPM portfolio with the STK551Uxx2A-E family. With a power range of 10A to 20A in SIP packaging, the new IPMs integrate a complete 3-phase inverter including the driver circuit. ON Semiconductor’s newest IGBT and driver technologies are also incorporated in the new family of IPMs, minimizing switching losses of the module.
The modules are based on Insulated Metal Substrate Technology™ (IMST) which produces many benefits over existing standard frame types including excellent thermal coupling and response, higher reliability, lower power losses, faster temperature monitoring, and reduced switching voltage surges. In addition, it allows for the integration of passive components. IMST uses aluminum plates as the base substrates which diffuses the heat very effectively.
• 3-phase power MOS/IGBT bridge
• On-board gate drivers
• IC low voltage flag
• Overcurrent flag
• On-board current sensor
• On-board temperature sensor
• Motor control systems
• Industrial/general control systems
• Clothes washer/dryer
• Industrial motor