Diodes – SBRT15U50SP5 and SBRT20U50SLP: Trench Super Barrier Rectifiers: Meet Efficiency Targets of Next Generation Chargers

The first devices to be launched from Diodes Incorporated’s proprietary TrenchSBR® (Super Barrier Rectifier) technology are enabling the stringent efficiency and temperature targets of next generation battery chargers to be achieved.

With their ultra low forward voltage, low leakage current and cooler running characteristics, the new TrenchSBRs meet the requirements of the charger output rectifier diode, easily coping with the shorter current pulses of 36kHz discontinuous mode charger designs.

Diodes Incorporated has initially introduced two devices: the 15A SBRT15U50SP5, for 10W smartphone chargers; and the 20A SBRT20U50SLP, for 12.5W tablet chargers. Such chargers are becoming smaller and thinner, and have efficiency and temperature targets that cannot be adequately met with traditional Schottky diode solutions.

SBRT15’s forward voltage of 0.47V at 15A and SBRT20’s forward voltage of 0.5V at 20A, coupled with an operating temperature of +90ºC, means conduction losses are minimized and charger efficiencies increased. The devices’ low reverse leakage currents at high temperatures, respectively 105mA and 100mA at +125ºC, also help minimize blocking mode losses.

The SBRT20U50SLP and SBRT15U50SP5 are the first rectifiers to be released from a complete portfolio of TrenchSBR devices that span a reverse voltage range from 10V to 100V, a current handling capability from 0.2A to 40A and a variety of different package options, including Diodes’ space-saving PowerDI®123, PowerDI5 and PowerDI5060.


  • Ultra Low Forward Voltage (VF): Ultra low forward voltage minimizes conduction losses reducing power dissipation
  • Low Reverse Leakage (IR): Ultra low leakage at high temperature minimizes reverse losses and extends battery life
  • Thermally Efficient Package: Low junction to ambient thermal resistance (RthJA) of 120C/W for the SBRT20U50SLP and 200C/W for the PowerDI5
  • Small Form Factor Package: The PowerDI5 and PowerDI5060 packages have off board profiles of <1.1mm enabling thinner solutions. The PowerDI5 and PowerDI5060 packages occupy just 40% of the PCB area taken by that of the industry standard DPak (TO252) package