Littelfuse – Introducing Two Series of 0.5pF, 12kV TVS Diode Arrays Designed to Prevent ESD Damage to High Speed Interfaces


Protection for V-By-One, Embedded DisplayPort, USB 2.0/3.0 Ports, HDMI, FPDs, LCD/LED TVs, and More

Littelfuse introduced two series of TVS Diode Arrays (SPA® Diodes) designed to safeguard many of the latest high speed interfaces from damage due to electrostatic discharges (ESD).

SP7538P series TVS Diode Arrays integrate eight channels of ultra low capacitance rail-to-rail diodes and an additional zener diode in a μDFN-9 package; SP0544T Series TVS Diode Arrays have a similar design but are smaller, with four channels of ultra low capacitance rail-to-rail diodes instead of eight. Both of these robust device series can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. Their extremely low loading capacitance also makes them ideal for protecting high speed signal pins.

Typical applications for both series include ESD protection for interfaces like V-by-One, Embedded DisplayPort, USB 2.0/3.0 ports, and HDMI, as well as flat panel displays, LCD/LED TVs, smartphones and mobile computing.

“The SP7538P and SP0544T series are appropriate for use in many of the same applications,” said Tim Micun, Product Manager/TVS Diode Arrays (SPA® Diodes). “The SP7538P Series is designed to permit straight-through routing for ultra high speed signals on DisplayPort and V-by-One interfaces, requires no fan out or fan in, and mates perfectly with the pitch on the board-to- board connectors. The SP0544T Series offers the same level of ESD performance as our earlier low capacitance TVS Diode Arrays, in a smaller outline, offering circuit designers a PCB space savings of roughly 25%.”

SP7538P and SP0544T Series TVS diodes offer these key benefits:

  • Their extremely low loading capacitance of 0.5pF (typ) per I/O reduces signal degradation and distortion for high speed applications.
  • They offer low dynamic resistance (0.4Ω), which provides low clamping performance to ensure better protection for sensitive chipsets.
  • Their enhanced ESD capability (±12kV contact, ±25kV air) permits manufacturers to achieve ESD protection beyond the maximum level stated in the IEC standard and protects against a multitude of other threats to ensure product reliability in the field.